Precision 0.015mm Line Width Micro Etched Lead Frame for Automobile
Product Overview
Xinhsen Technology specializes in manufacturing precision-etched lead frames for semiconductor and microelectronics packaging. Our lead frames serve as the critical interconnection platform for IC chips, providing superior electrical conductivity, heat dissipation, and mechanical stability. Utilizing advanced chemical etching technology, we deliver products with unmatched dimensional accuracy for applications in QFN, DFN, SOP, SSOP and other advanced packaging formats.
Key Features
Ultra-Precise Etching Technology
Achieves fine pitch down to 0.05mm with tight tolerance of ±0.01mm
Produces smooth burr-free edges for perfect die attachment
Material Expertise
Works with various alloys including Cu (C194, C7025), Fe-Ni (Alloy 42), and Kovar
Thickness range: 0.1mm-1.0mm
Advanced Design Capabilities
Complex multi-array patterns with precise half-etching technology
Custom geometries for specific thermal/electrical requirements
Superior Quality
Flatness control within 0.02mm/mm²
100% automated optical inspection
Technical Parameters
Material Options: Copper alloys (C194, C7025), Alloy 42, Kovar
Thickness Range: 0.1mm-1.0mm
Minimum Pitch: 0.05mm
Tolerance: ±0.01mm (critical dimensions)
Surface Roughness: Ra ≤ 0.8μm
Package Types: QFN, DFN, SOP, SSOP, DIP, etc.
Competitive Advantages
Precision Beyond Stamping
Achieves finer features and tighter tolerances than conventional stamping
No mechanical stress or deformation
Performance Data
| Characteristic | Xinhsen Standard | Test Method |
| Plating Adhesion | ≥5B (ASTM B571) | Tape Test |
| Solderability | ≥95% coverage | J-STD-003 |
| Thermal Cycling | 1000 cycles (-55°C~125°C) | JESD22-A104 |
| Wire Bond Strength | ≥8gf (1mil Au wire) | MIL-STD-883 Method 2011 |
Rapid Prototyping
Sample lead time: 5-7 working days
DFM analysis included
Cost-Effective Solutions
Lower tooling costs compared to stamping
Flexible MOQ from prototypes to mass production
Comprehensive Services
One-stop solution from design to plating (Ag, NiPdAu, etc.)
ISO 9001 & IATF 16949 certified
FAQ
Q: What's the benefit of etched lead frames vs stamped ones?
A: Etching provides better precision (especially for fine pitch), no burrs, and no mechanical stress on materials.
Q: Can you handle lead frame arrays for multi-chip packaging?
A: Yes, we specialize in high-density multi-array designs with precise half-etching technology.
Q: What surface finishes do you offer?
A: We provide various plating options including silver, NiPdAu, and selective plating.
Q: What's your typical production capacity?
A: We support mass production up to 50 million units/month with consistent quality control.
Why Choose Xinhsen?
With 15+ years of precision etching experience, we combine cutting-edge technology with stringent quality control to deliver lead frames that meet the most demanding semiconductor requirements. Our technical team works closely with clients to optimize designs for performance and manufacturability.
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