Photo Chemical Etching Micro Etched Lead Frames with Customized Materials

Photo Chemical Etching Micro Etched Lead Frames with Customized Materials

Lead Frames Overview

Xinhaisen Technology specializes in manufacturing precision-etched lead frames for semiconductor and microelectronics packaging. Our lead frames serve as the critical interconnection platform for IC chips, providing superior electrical conductivity, heat dissipation, and mechanical stability. Utilizing advanced chemical etching technology, we deliver products with unmatched dimensional accuracy for applications in QFN, DFN, SOP, SSOP and other advanced packaging formats.

Lead Frames Features

·Ultra-Precise Etching Technology

·Achieves fine pitch down to 0.05mm with tight tolerance of ±0.01mm

·Produces smooth burr-free edges for perfect die attachment

Lead Frames Specification

Competitive Advantages

·Precision Beyond Stamping

·Achieves finer features and tighter tolerances than conventional stamping

·No mechanical stress or deformation

FAQ

1.Why Choose Xinhaisen?

·13+ years of specialized etching experience

·Engineering support from design to final product

·Strict confidentiality protection for all customer designs

2.How long does production and shipping take?

A: Sample orders can be shipped in 3-5 days. Mass production lead time depends on quantity, typically 1-2 weeks. Express shipping is available.

3. What services can we provide?

·Accepted Delivery Terms: FOB,CFR,CIF,EXW；

·Accepted Payment Currency:USD,EUR,JPY,CAD,AUD,HKD,CNY;

·Accepted Payment Type: T/T,Paypal,Western Union,Cash;

·Language Spoken:English,Chinese

Welcome to contact!

Precision Etched Lead Frame

0.015mm Etched Lead Frame

Automobile lead frame etching process

Photo Chemical Etching Micro Etched Lead Frames with Customized Materials Images